![]() ![]() This study thus contributes to a greater and more detailed understanding of the production flow, scientific practices, and trends in this new and stimulating field of research. The results include four clusters, namely, (1) Absorption Capacity, Knowledge and Competitiveness in University-Industry Relations, (2) Impact of Knowledge Spill-overs on University-Industry Relations, (3) Strategic Alliances for Industry Innovation, and (4) University-Industry Cooperation. ![]() This systematic literature review revealed that companies are increasingly focused on cooperation with universities. The articles reviewed were obtained with a search of the ISI's Web of Science and were submitted to a bibliometric analysis using VOSviewer software. clusters) they form and (2) discuss the challenges this literature presented in the study of university-industry cooperation. This study's objectives were to (1) identify the main co-cited references and the groups (i.e. The present research, thus, sought to explore and analyse the literature related to university-industry cooperation, using a co-citation analysis. Therefore, IPC expertise will assist the repairer make a choice on the repaired units without relying on In-Circuit-Test (ICT) and Functionality-Circuit-Test(FCT).Īs university-industry cooperation is associated with the transfer of knowledge and technology, this collaboration is an extremely important field of study for the world's economies that helps companies become more competitive. In addition, purchasing repaired device becomes popular among clients who prefer to own more than one device such as mobile phone, laptop, tablet and other electronic gadgets. Currently, end consumers prefer to repair the electronics gadget instead of buying the fresh units. The goal of this study is to construct standard understanding of International Patent Classification (IPC) among Malaysian engineering students during their practical activity in engineering laboratory. In this context, it is most welcome to repair the defective Printed Circuit Board Assembly (PCBA) by using "manual soldering" because manual soldering can be carried out immediately without queuing in the soldering oven (James et al., 2019). Since defects cannot be eliminated but can be reduced the method called rework and troubleshooting carries weight to repair the faulty components turn into good components. Introduction of instruments such as Six Sigma and Total Quality Management emphasis on minimizing the frequency of occurrence of defects. Even though SMT has conquered the electronics era in recent decades manual soldering still plays a significant part behind the scene. ![]() ![]() Component connectivity has been converted from manual soldering to surface mount technology (SMT) or well known as a solder paste technology. Printed circuit board (PCB) creates platform for the majority of the electronic component placement. ![]()
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